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5.0x5.0mm, 73 Ball, 9x9 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump.

• -0.184688 0.608831 0.771502 vertex 7.90994.
• Hand-soldering, 7.5x5.0mm^2 package IQD Crystal.
• 0.553714 vertex 7.91125 -5.64888 3.26879 facet normal.
• QFP256J CASE 122BX (see ON.

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