Labels Milestones
BackR-XBGA-N6 Texas Instruments, DSBGA, 1.5195x1.5195x0.600mm, 8 ball 3x3 area grid, YZP, YZP0010, 1.86x1.36mm, 10 Ball, 3x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf BGA 12 0.5 R-XBGA-N12 Texas Instruments, DSBGA, area grid, YBG pad definition, 0.8875x1.3875mm, 5 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g491re.pdf ST WLCSP-81, ST die ID 461, 4.63x4.15mm, 115 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g0b1ne.pdf#page=136 ST WLCSP-64, ST die ID 468, 3.15x3.13mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g491re.pdf ST WLCSP-81, ST die ID 483, 3.73x4.15mm, 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch, https://www.onsemi.com/pdf/datasheet/ncp163-d.pdf#page=23 6pin.
- 0.560081 -0.682453 0.469646 facet normal -0.758285 -0.622326.
- -0.831471 1.34063e-06 facet normal 8.456261e-02 -2.365524e-03 -9.964154e-01 facet.
- Vertex -9.738418e+01 9.170864e+01 1.055000e+01 facet normal -0.115801 0.000135683.
- 6.0x3.0mm^2, length*width=6.0x3.0mm^2 package, package length=5.5mm, package width=3.0mm.
- -0.618852 0.265169 0.739397 facet normal 0.113987.