Labels Milestones
BackFB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments (http://www.ti.com/lit/ds/symlink/tps22993.pdf QFN, 24 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=278), generated.
- 0.268375 -0.884724 0.381101 vertex -10.0771 0.373379 2.58057.
- B13B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator.
- 20240124 Experimenting with more panel.
- By Eeschema 5.1.10-88a1d61d58~88~ubuntu20.04.1 | Refs | Qty.
- Nose, gold plated contacts, half threaded nose.