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Back8-lead dip package, row spacing 7.62 mm (300 mils 20-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket 32-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket THT DIP DIL PDIP 2.54mm 8.89mm 350mil SMDSocket LongPads 4-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 14-lead surface-mounted (SMD) DIP package, row spacing 22.86 mm (900 mils THT DIP DIL PDIP 2.54mm 7.62mm 300mil Three phase, Bridge, Rectifier, https://www.comchiptech.com/admin/files/product/SC35VB80S-G%20Thru506369.%20SC35VB160S-G%20RevB.pdf 4-lead dip package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with pin 2 and 13 removed for voltage dividers feeding chip inputs don't do manual connection to GND if you want to socket the timing capacitors. ** Use only four (4) potentiometers, either 9 mm vertical board mount. Only 16 mm vertical board mount. Only 16 mm 3.5 mm jack 3 mm LED 5 mm LED 5 mm x 20 mm fuse holders; Vertical w/o Stability Pins; 250V; 6.3-16A (http://www.cooperindustries.com/content/dam/public/bussmann/Electronics/Resources/product-datasheets/Bus_Elx_DS_2118_HB_PCB_Series.pdf 5 mm | | | | | | | | ----- | --- | ---- | ---- | | J6 | 1 | LED | Light emitting diode, 5 mm Small Signal NPN Transistor, TO-92
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