Labels Milestones
BackOrd*sin(lf1), h1], [ ord*cos(lf0), ord*sin(lf0), h2], [ ird*cos(lf1), ird*sin(lf1), h0], [ ird*cos(lf0), ird*sin(lf0), h1], [ ord*cos(lf0), ord*sin(lf0), h0], [ ird*cos(lf0), ird*sin(lf0), h1], [ ird*cos(lf2), ird*sin(lf2), h1], [ 0,0,h2], Created on Tue Mar 5 20:19:51 2024 Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) Total plated holes Total unplated holes count 16 Not plated through holes are merged with plated holes unplated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots T2 5.000mm 0.1969" (1 hole T3 7.000mm 0.2756" (6 holes T4 10.000mm 0.3937" (4 holes) (with 4.
- -3.25446 -8.23926 11.2377 vertex -3.18698.
- Vertex 0.388301 10.1521 0 facet.
- 0.757711 -0.648786 0.070359 facet.
- Receptable with flange, bottom-mount.