Labels Milestones
Back1 FT256 FTG256 Spartan-7 BGA, 14x14 grid, 8x8mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition Appendix A BGA 225 0.8 CSGA225 Spartan-7 BGA, 14x14 grid, 15x15mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=302, NSMD pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, DSBGA, 3.0x1.9x0.625mm, 28 ball 7x4 area grid, NSMD pad definition Appendix A Artix-7 and Zynq-7000 BGA, 20x20 grid, 17x17mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=265, NSMD pad definition Appendix A Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=262, NSMD pad definition Appendix A Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=304, NSMD pad definition Appendix A BGA 324 0.8 GateMate FPGA Maxim WLP-12, W121H2+1, 2.008x1.608mm, 12 Ball, 4x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g0b1ne.pdf#page=136 ST WLCSP-64, ST die ID 472, 4.36x4.07mm, 81 Ball, 9x9 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/dac80508.pdf Analog LFCSP, 16 Pin (https://www.st.com/resource/en/datasheet/stp08cp05.pdf#page=20), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-109-02-xx-DV-PE-LC, 9 Pins per row (http://www.molex.com/pdm_docs/sd/530480210_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole straight socket strip, 2x06, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole pin header THT 2x09 2.00mm double row Through hole angled pin header SMD 2x36 1.27mm double row surface-mounted straight pin header, 2x24, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole IDC header, 2x06, 1.27mm pitch, single row style1 pin1 left Surface mounted socket strip SMD 1x39 2.54mm single row Through hole angled socket strip SMD 1x32 2.00mm single row Through hole angled socket strip THT 2x29 2.54mm double row Through hole pin header THT 2x05 2.54mm double row surface-mounted straight pin header, 2x06, 1.27mm pitch, single row style2 pin1 right Through hole angled socket strip, 1x03, 2.54mm pitch, double rows Through hole pin header THT 1x30 1.00mm single row style2 pin1 right Through hole angled pin header, 1x02, 1.27mm pitch, single row Through hole angled pin header, 2x25, 2.54mm pitch, single row style1 pin1 left Surface mounted pin header THT 1x06 2.54mm single row style2 pin1 right Through hole angled pin header, 2x04, 2.54mm pitch, 8.51mm socket length, double cols (from Kicad 4.0.7), script generated Through hole Samtec HPM power header series 11.94mm post length, 1x16, 5.08mm pitch, single row Through hole pin header THT 2x24 2.54mm double row Through hole angled socket strip SMD 1x30 1.00mm single row style2 pin1 right Through hole straight pin header, 1x27, 1.27mm pitch, single row Through hole socket strip THT 2x22 2.54mm double row Through hole straight.
- Lead Package (MA) - 2x2x0.9 mm Body [SSOP.
- 4.6, Wuerth electronics 9775046960 (https://katalog.we-online.com/em/datasheet/9775046960.pdf), generated with kicad-footprint-generator.