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Footprints to fireball Minor layout tweaks From 8f3ce8359ba460976b5ffcbe5a92590e33120bbc Mon Sep 17 00:00:00 2001 Subject: [PATCH] Update current state of project. 9db3fb2a68 Add cascading input and send reset to clk_inh to stop progressing Add cascading input and output jacks Latest commits for file Panels/fireball_vco_14hp_v1.scad adds front panel and PCBs are not limited to the public domain with CC0 1.0. ------------------------------------------------------------------------------- Creative Commons Attribution-NonCommercial-ShareAlike 3.0 Unported License. Based on a stem to form a mushroom shape. Enable_stem = false; // Scale factor for the sake of code complexity. Odd values are -=1 difference() { difference() { union() { Panels/luther_triangle_10hp_pcb_holder.stl Normal file Unescape Hardware/Panel/precadsr_panel_al_Gerbers/precadsr_panel_al-F_Cu.gbr Normal file View File Images/retrigger.png Normal file Unescape 2x Sockets, all three pins need wires: glide in (j16/j17) // cv out // CV out // cv switch // Note: don't mess with them. Cylinder(r1=knob_radius_bottom,r2=knob_radius_top,h=knob_height, $fn=knob_smoothness); smoothing(); } external_direction_indicator(); } shaft_hole(); } set_screw_hole(); } arrow_indicator(); indentations(); } } module label(string, size=4, halign="center", height=thickness+1, font=default_label_font) { color([1,0,0]) linear_extrude(thickness+1) text(string, size, halign=halign, font=font_for_label); } //module title(string, size=9, halign="center", font="Futura Md BT:style=Medium") { text(string, size, halign=halign); } .. Futura Heavy BT.ttf => Panels/Futura Heavy BT.ttf => Panels/Futura Heavy BT.ttf (grid_origin 84.5 17.5 Mark board for a single 1 mm² wires, reinforced insulation, conductor diameter 1.25mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-2V 0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 1 mm² wires, basic insulation, conductor diameter 1.4mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 36 Pin (JEDEC MO-153 Var AET Pkg.Code U28E-4 https://pdfserv.maximintegrated.com/package_dwgs/21-0108.PDF), generated with kicad-footprint-generator ipc_noLead_generator.py Texas WSON-6 DQK, http://www.ti.com/lit/ds/symlink/csd16301q2.pdf Texas DRC0010J, VSON10 3x3mm Body, 0.5mm Pitch, S-PVSON-N10, DRC, http://www.ti.com/lit/ds/symlink/tps61201.pdf 3x3mm Body, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/tps63000.pdf 3x3mm Body, 0.5mm Pitch, S-PVSON-N10, DRC, http://www.ti.com/lit/ds/symlink/tps61201.pdf 3x3mm Body, 0.5mm Pitch, https://ww1.microchip.com/downloads/en/DeviceDoc/16B_WLCSP_CS_C04-06036c.pdf WLCSP-20, 4x5 raster, 1.934x2.434mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf UFBGA-144, 12x12 raster, 7x7mm package, pitch 0.35mm; https://datasheets.maximintegrated.com/en/ds/MAX40200.pdf WLP-9, 1.448x1.468mm, 9 Ball, 3x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf ST WLCSP-115, ST die ID 464, 2.58x3.07mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A BGA 676 1 FF676 FFG676 FFV676 Kintex-7 and Zynq-7000 BGA, 15x15 grid, 13x13mm.

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