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DF11-24DP-2DSA, 12 Pins per row (http://www.molex.com/pdm_docs/sd/530470610_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 5 times 0.1 mm² wires, reinforced insulation, conductor diameter 1.7mm, size source Multi-Contact FLEXI-E 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.5 mm² wires, reinforced insulation, conductor diameter 2mm, outer diameter 3.5mm, hole diameter 2.8mm SMD rectangular pad as test Point, diameter 1.0mm test point wire loop with bead as test Point, diameter 4.0mm, hole diameter 1.0mm wire loop as test point, loop diameter2.548mm, hole diameter 1.3mm, wire diameter 1.0mm THT pad as test point, pitch 6.35mm, hole diameter 0.7mm THT pad as test Point, diameter 3.0mm z-position of LED center 3.0mm, 2 pins, diameter 1.8mm size 1.8x2.4mm^2 z-position of LED center 1.0mm, 2 pins, diameter 1.8mm size 1.8x2.4mm^2 z-position of LED center 1.6mm, 2 pins, http://cdn-reichelt.de/documents/datenblatt/A500/LED8MMGE_LED8MMGN_LED8MMRT%23KIN.pdf LED diameter 5.0mm z-position of LED center 2.0mm, 2 pins.

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