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XBGA-121, 11x11 raster, 10x10mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00257211.pdf WLCSP-49, 7x7 raster, 2.999x3.185mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=93, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=261, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double rows Through hole angled socket strip, 2x34, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled socket strip SMD 1x14 2.54mm single row Through hole straight pin header, 1x02, 1.27mm pitch, double rows Through hole IDC header, 2x32, 1.27mm pitch, double rows Through hole angled pin header, 2x15, 1.27mm pitch, single row style2 pin1 right Through hole angled socket strip, 2x34, 2.54mm pitch, 6mm pin length, single row style1 pin1 left Surface mounted pin header SMD 1x22 1.00mm single row Surface mounted pin header THT 2x23 2.54mm double row surface-mounted straight socket strip, 2x11, 2.00mm pitch, double rows Through hole pin header THT 2x06 2.54mm double row Through hole angled socket strip, 2x38, 1.27mm pitch, single row style1 pin1 left Surface mounted pin header THT 2x26 1.27mm double row Through hole straight pin header, 2x01, 1.27mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf.

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