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0.5mm, http://www.analog.com/media/en/package-pcb-resources/package/57080735642908cp_8_4.pdf LFCSP 8pin Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments EUS 5 Pin Double Sided Module Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 (perimeter) array, NSMD pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 14x14.

• 7.669265e-001 -0.000000e+000 vertex 1.951762e+000 6.764269e+000 2.496000e+001.
• Normal -0.0817448 0.0561705 0.995069 vertex -5.16066 6.47125.

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