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900mil 64-lead though-hole mounted DIP package, row spacing 5.9 mm (232 mils), body size 10.8x9.18mm 3x-dip-switch SPST , Slide, row spacing 5.08 mm (200 mils), body size 10.8x14.26mm 5x-dip-switch SPST , Slide, row spacing 10.16 mm (400 mils 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x22.5mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 7x-dip-switch SPST CTS_Series194-7MSTN, Piano, row spacing 7.62 mm (300 mils), body size 9.78x25.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 3x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), LongPads, see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf Power Integrations K Package PowerPAK SO-8 Dual (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72600/72600.pdf PowerPAK SO-8 Single (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72599/72599.pdf 16-Lead Plastic DFN (7mm x 4mm) (see Linear Technology 05081733_A_DF12.pdf DFN12, 4x4, 0.65P; CASE 506CE (see ON Semiconductor 506CN.PDF DC8 Package 8-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body with Exposed Pad (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Shrink Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf HSOP, 8 Pin (http://www.ti.com/lit/ds/symlink/tps82130.pdf#page=19), generated with kicad-footprint-generator Inductor SMD Pulse PA4320 http://productfinder.pulseeng.com/products/datasheets/P787.pdf Inductor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal.

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