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Though-hole, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 20-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 6-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils.

• -0.163178 -0.548101 vertex -3.36082 0 18.4724 vertex.
• 2.5787307,3.1496068 h -0.19685" d="M 2.4803057,4.4291344.
• -4.056728e+000 5.738834e+000 1.747200e+001 facet normal.
• 5 + flat_size_adjustment; // some.
• Clearance (UCC256301, https://www.ti.com/lit/ds/symlink/ucc256301.pdf SOIC.

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