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RND 205-00063 45Degree pitch 5mm size 6.5x15mm^2 drill 1.2mm pad 3mm Terminal Block Phoenix PT-1,5-11-3.5-H, 11 pins, pitch 7.5mm, size 22.5x10.3mm^2, drill diamater 1.3mm, pad diameter 3mm, see http://www.metz-connect.com/de/system/files/METZ_CONNECT_U_Contact_Katalog_Anschlusssysteme_fuer_Leiterplatten_DE_31_07_2017_OFF_024803.pdf?language=en page 134, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix THT Terminal Block 4Ucon ItemNo. 10701, vertical (cable from top), 8 pins, pitch 5mm, size 20x8mm^2, drill diamater 1.3mm, pad diameter 2.1mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00232_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block Metz Connect Type101_RT01604HBWC, 4 pins, pitch 10mm, size 62.3x14mm^2, drill diamater 1.3mm, pad diameter 3mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 2 times 0.15 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter 1mm, size source Multi-Contact FLEXI-xV 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-0103, 3 Pins per row (https://cdn.harwin.com/pdfs/M20-781.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-150-02-xxx-DV-BE-A, 50 Pins (http://www.molex.com/pdm_docs/sd/555600207_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-116-02-xxx-DV-BE-LC, 16 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0834-6-81&productname=DF12E(3.0)-50DP-0.5V(81)&series=DF12&documenttype=2DDrawing&lang=en&documentid=0000992393), generated with kicad-footprint-generator Molex CLIK-Mate series connector, B14B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py FE Package; 16-Lead Plastic DFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (3mm x 3mm) (see Linear Technology 05081707_A_DHD16.pdf DH Package; 16-Lead Plastic Small Outline (SS)-5.30 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with pin 2 and 13 removed for voltage clearance (UCC256301, https://www.ti.com/lit/ds/symlink/ucc256301.pdf SOIC, 14 Pin (https://m.littelfuse.com/~/media/electronics/datasheets/tvs_diode_arrays/littelfuse_tvs_diode_array_sp3012_datasheet.pdf.pdf#page=7), generated with kicad-footprint-generator Harting har-flexicon series connector, B12B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator Molex Molex 0.30mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0270, 27 Circuits (http://www.molex.com/pdm_docs/sd/5022502791_sd.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 52991-0608, 60 Pins (http://www.molex.com/pdm_docs/sd/5024301410_sd.pdf), generated with kicad-footprint-generator JST SH series connector, B28B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated.

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