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4x3 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row Through hole angled socket strip, 1x16, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf SMD vertical IDC header THT 1x19 1.00mm single row (from Kicad 4.0.7), script generated Through hole straight pin header, 2x40, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole socket strip SMD 2x39 2.54mm double row Through hole angled pin header, 1x21, 2.00mm pitch, single row style2 pin1 right Through hole pin header SMD 1x19 2.00mm single row style2 pin1 right Through hole straight socket strip, 2x38, 1.27mm pitch, 4.0mm pin length, double rows Surface mounted pin header THT 1x34 2.54mm single row style1 pin1 left Surface mounted socket strip THT 1x11 2.00mm.

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