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Relay SPDT Omron Serie G6E Relay SPDT IM-relay HJR-4102 Omron Relay SPDT Omron Serie G6E Relay SPDT Omron Serie G6E Relay SPDT Omron Serie G5Q, http://omronfs.omron.com/en_US/ecb/products/pdf/en-g5q.pdf Relay SPDT Finder 40.11, https://www.finder-relais.net/de/finder-relais-serie-40.pdf Relay DPDT Finder 40.52, Pitch 5mm/7.5mm, https://www.finder-relais.net/de/finder-relais-serie-40.pdf Relay DPDT IM-relay FRT5 Kemet signal relay, DPDT, double coil latching, https://content.kemet.com/datasheets/KEM_R7002_EC2_EE2.pdf Kemet EC2 signal relay DPDT double dual coil latching through hole M3, height 11, Wuerth electronics 9774030360 (https://katalog.we-online.de/em/datasheet/9774030360R.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-117-02-xxx-DV-LC, 17 Pins per row (https://datasheet.lcsc.com/lcsc/1811040204_JUSHUO-AFC07-S32FCC-00_C11061.pdf Jushuo AFC07, FFC/FPC connector, FH12-36S-0.5SH, 36 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0694-9-81&productname=DF12C(3.0)-50DS-0.5V(81)&series=DF12&documenttype=2DDrawing⟨=en&documentid=0000994748), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 5569-14A2, example for new mpn: 39-29-4209, 10 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: AE-6410-09A example for new part number: AE-6410-13A example for new mpn: 39-29-4049, 2 Pins per row (http://www.molex.com/pdm_docs/sd/1053101208_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-125-02-xxx-DV, 25 Pins per row (http://www.molex.com/pdm_docs/sd/431600105_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 3x4 (perimeter) array, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole socket strip THT 2x25 1.27mm double row Through hole pin header THT 1x34 1.00mm single row Through hole angled pin header SMD 1x31 1.27mm single row style1 pin1 left Surface mounted pin header SMD 2x31 1.00mm double row Through hole angled pin header, 2x26, 2.54mm pitch, single row (from Kicad 4.0.7), script generated Through hole angled pin header, 2x18, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 1x14, 1.00mm pitch, 2.0mm pin length, double rows Through hole Samtec HPM power header series 11.94mm post length, 1x11, 5.08mm pitch, single row Surface mounted socket strip THT 2x17 2.54mm double row surface-mounted straight socket strip, 2x40, 2.00mm pitch, 4.2mm pin.

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