Labels Milestones
BackOutline Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 12-lead surface-mounted (SMD) DIP package, row spacing 8.89 mm (350 mils), body size 6.7x11.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD DIP.
- -0.021876 -0.994799 vertex 9.99509 4.54744e-06 0.0491304 facet normal.
- -0.423688 0.0993032 facet normal.