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13mm from the IDC through the board, cross at 90° to minimize capacitance between traces vias connect through the power.

• (https://www.analog.com/media/en/technical-documentation/data-sheets/MAX4460-MAX4462.pdf#page=19, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tdfn-ep/21-0137.pdf), generated with kicad-footprint-generator.
• -0.821707 19.9 vertex 6.19038 1.70385 19.9.
• Overlap for unions and.

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