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14-lead surface-mounted (SMD) DIP package, row spacing 6.15 mm (242 mils.

• 0.843303 0.0703594 vertex -0.632644 -8.44206 17.8205.
• 8x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g431c6.pdf.
• -0.678848 0.362853 -0.63836 facet.
• Normal -4.127371e-001 7.075877e-001 5.735571e-001 vertex 2.587998e+000 -4.442636e+000 2.484855e+001.
• TO-220F-3, Horizontal, RM 1.7mm, IIPAK, I2PAK, see http://www.onsemi.com/pub/Collateral/EN8586-D.PDF.

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