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Vias; see section 7.8 of http://www.st.com/resource/en/datasheet/DM00387108.pdf Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition Appendix A BGA 1760 1 FF1761.

• [mm] cone_indents_bottom_radius = 7.2; .
• -7.089681e-001 -5.456855e+000 2.480400e+001 facet.

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