Labels Milestones
BackYZR0009 Texas Instruments, DSBGA, 1.36x1.86mm, 12 bump 3x4 (area) array, NSMD pad definition Appendix A Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=273, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=284, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=84, NSMD pad definition Appendix A BGA 400 0.8 CLG400 CL400 Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=77, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Surface mounted socket strip SMD 1x14 1.27mm single row style2 pin1 right Through hole socket strip SMD 1x30 2.54mm single row style2 pin1 right Through hole horizontal IDC header THT 2x27 2.00mm double row surface-mounted straight pin header, 2x32, 1.27mm pitch, 4.4mm socket length, double cols (from Kicad 4.0.7), script generated Through hole pin header THT 1x24 2.54mm single row Surface mounted pin header THT 2x18 1.27mm double row Through hole socket strip THT.
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