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Http://www.st.com/resource/en/datasheet/stm32f303r8.pdf WLCSP-49, 7x7 raster, 3.141x3.127mm package, pitch 0.5mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f401vc.pdf WLCSP-49, 7x7 raster, 2.965x2.965mm package, pitch 0.4mm; see section 36.2.3 of http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-42363-SAM-D11_Datasheet.pdf WLCSP-56, 7x8 raster, 3.170x3.444mm package, pitch 0.65mm WLP-4, 2x2 raster, 0.73x0.73mm package, pitch 0.35mm; https://datasheets.maximintegrated.com/en/ds/MAX40200.pdf WLP-9, 1.448x1.468mm, 9 Ball, 3x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l496wg.pdf ST WLCSP-132, ST die ID 460, 2.3x2.48mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf ST WLCSP-115, ST die ID 494, 3.3x3.38mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, http://www.st.com/content/ccc/resource/technical/document/technical_note/92/30/3c/a1/4c/bb/43/6f/DM00103228.pdf/files/DM00103228.pdf/jcr:content/translations/en.DM00103228.pdf pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf UFD Package, 4-Lead Plastic Small Outline (SO), see https://docs.broadcom.com/docs/AV02-0173EN 4-Lead Plastic Small Outline Package (MS) [MSOP] (see Microchip datasheet http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf MLF, 20 Pin (http://www.ti.com/lit/ds/symlink/tlc5971.pdf#page=37&zoom=160,-90,3), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 12 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/3652fe.pdf#page=24), generated with kicad-footprint-generator JST SHL series connector, S18B-PUDSS-1 (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator JST XH series connector, DF3EA-02P-2H (https://www.hirose.com/product/document?clcode=CL0543-0332-0-51&productname=DF3EA-5P-2H(51)&series=DF3&documenttype=2DDrawing&lang=en&documentid=0001163317), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 4 times 2.5 mm² wires, reinforced insulation, conductor diameter 2mm, size source Multi-Contact FLEXI-E 0.1 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST GH series connector, LY20-8P-DT1, 4 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ103130.pdf), generated with kicad-footprint-generator Harwin Male Horizontal Surface Mount Slide Switch, right-angle, https://www.ckswitches.com/media/1424/pcm.pdf 0 Littlefuse 14.73x2.54mm, 175VDC 5W, SPDT Reed Switch CT10-XXXX-G4 ALPS 5.2mm Square Low-profile Type (Surface Mount) SKQG Series, Without stem, http://www.alps.com/prod/info/E/HTML/Tact/SurfaceMount/SKQG/SKQGAEE010.html TL3305 Series Tact Switch with High Contact Reliability, Top-actuated Model, with Ground Terminal, without Boss Ultra-small-sized Tactile Switch with High Contact Reliability, Top-actuated Model, without Ground Terminal, without Boss Ultra-small-sized Tactile Switch with High Contact Reliability, Side-actuated Model, without Ground Terminal, without Boss Ultra-small-sized Tactile Switch with High Contact Reliability, Top-actuated Model, without Ground Terminal, with Boss Ultra-small-sized Tactile Switch with High Contact Reliability, Top-actuated Model, without Ground Terminal, without Boss Ultra-small-sized Tactile Switch for High-Density Packaging with Ground Terminal, without Boss Ultra-small-sized Tactile Switch with High Contact Reliability, Side-actuated Model, with Ground Terminal, without Boss Ultra-small-sized Tactile Switch SPST Slide 7.62mm 300mil PowerIntegrations variant of 8-Lead Plastic Dual Flat, No Lead Package (MC) - 2x3x0.9 mm Body [TQFP] With 4.5x4.5 mm Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf DFN package size 11.5x8.5x17.5mm^3, https://www.recom-power.com/pdf/Innoline/R-78HBxx-0.5_L.pdf DCDC-Converter.

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