Labels Milestones
Back16.90 mm Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket.
- -8.438430e+01 9.755134e+01 1.512829e+01 facet.
- Http://simcom.ee/documents/SIM800C/SIM800C_Hardware_Design_V1.05.pdf Quad-Band GSM/GPRS module, 24x24x3mm, http://simcom.ee/documents/SIM900/SIM900_Hardware%20Design_V2.05.pdf.
- Pressed, short +12V and Reset.