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LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes are merged with plated holes unplated through holes: unplated through holes: merged pull request 'new_footprints' (#5) from new_footprints into main Reviewed-on: https://gitea.circuitlocution.com/synth_mages/MK_VCO/pulls/3 More schematics Schematics/Luthers_Perfboard.pdf | Bin 0 -> 11916 bytes .../MIRROR IMAGE.png | Bin 0 -> 12821 bytes .../COLOR SPRAY.png | Bin 0 -> 144834 bytes .../Pot_Knobs/pot_knob_two_parts_cap.stl | Bin 16700 -> 0 bytes Binary files /dev/null and b/Schematics/bad_trace_v1.jpeg differ Panels/luther_triangle_vco_quentin_v4.scad Normal file Unescape Schematics/Enlarge/Enlarge.kicad_pro Normal file View.

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