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Heatsink TO-252 TO-263 TO-268 23x13 mm SMD heatsink for TO-252 TO-263 TO-268, https://www.fischerelektronik.de/pim/upload/fischerData/cadpdf/base/fk_244_13_d2_pak.pdf heatsink TO-252 TO-263 TO-268, https://www.fischerelektronik.de/pim/upload/fischerData/cadpdf/base/fk_244_13_d_pak.pdf Heatsink, 35mm x 13mm, 2x Fixation 2,5mm Drill, Soldering, Fischer SK104-STC-STIC, Heatsink, Sheet type, 50x7mm, 2 fixations (solder), Choke, SMD, 7.3x7.3mm 4.5mm height Choke, SMD, 10.4x10.4mm 4.8mm height Choke, SMD, 6.3x6.3mm 3mm height Choke, SMD, 4.0x4.0mm 2.1mm height, https://www.tracopower.com/products/tck141.pdf Low Profile, High Current Inductor, body 41x36mm, https://www.we-online.com/catalog/en/WE-HCFT#/articles/WE-HCFT-3540 3.2mm x 2.8mm PLCC4 RGB LED, through hole, DF11-18DP-2DSA, 9 Pins per row (http://www.molex.com/pdm_docs/sd/431605304_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-128-02-xxx-DV-A, 28 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-2P-1.25DSA%2850%29/), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-106-02-xxx-DV-BE-A, 6 Pins per row (https://www.hirose.com/product/document?clcode=&productname=&series=DF11&documenttype=Catalog⟨=en&documentid=D31688_en), generated with kicad-footprint-generator Molex Pico-Lock series connector, BM04B-ZESS-TBT (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 1.5, Wuerth electronics 9774130960 (https://katalog.we-online.de/em/datasheet/9774130960.pdf,), generated with kicad-footprint-generator ipc_noLead_generator.py GPS Module, 15.5x15.5x6.3mm, https://www.u-blox.com/sites/default/files/SAM-M8Q_HardwareIntegrationManual_%28UBX-16018358%29.pdf GPS GNSS ublox ZED GSM NB-IoT Module BC66 M66 GSM NB-IoT Module BC66 M66 GSM NB-IoT Module BC66 M66 GSM NB-IoT module, 15.8x17.7x2mm, https://www.quectel.com/UploadImage/Downlad/Quectel_BC66_Hardware_Design_V1.1.pdf GSM NB-IoT Module BC66 M66 GSM NB-IoT module, 15.8x17.7x2mm, https://www.quectel.com/UploadImage/Downlad/Quectel_BC66_Hardware_Design_V1.1.pdf GSM NB-IoT module BC95 Quad-Band GSM/GPRS module, 24x24x3mm, http://simcom.ee/documents/SIM900/SIM900_Hardware%20Design_V2.05.pdf Telit xL865 familly footprint, http://www.telit.com/fileadmin/user_upload/products/Downloads/3G/Telit_UL865_Hardware_User_Guide_r8.pdf ublox Sara GSM/HSPA modem, https://www.u-blox.com/sites/default/files/SARA-G3-U2_SysIntegrManual_%28UBX-13000995%29.pdf, pag.162 ublox SARA-G3 SARA-U2 GSM HSPA Footprint for Mini-Circuits case CD542 (https://ww2.minicircuits.com/case_style/CD542.pdf) using land-pattern PL-049, including GND-connections and vias (https://ww2.minicircuits.com/pcb/98-pl049.pdf Ai Thinker Ra-01 LoRa module wireless zigbee 802.15.4 flash crypto ATSAMR21G18 AT45DB041E TECC508A U.Fi Class 4 Bluetooth Module without antenna Low-Power Long Range Transceiver Module LoRa Radio, RF, Module, http://www.hoperf.com/upload/rf/RFM69HW-V1.3.pdf 8 pin SIM connector for 1.6mm PCB's with 70 contacts (polarized Highspeed card edge card connector socket for 1.57mm PCBs, vertical, alignment pins, weld tabs, board locks (source: https://suddendocs.samtec.com/prints/hsec8-1xxx-xx-xx-dv-x-xx-footprint.pdf 0.8 mm Highspeed card edge connector for 1.6mm PCB's with 05 contacts (not polarized Highspeed card edge connector for 1.6mm PCB's with 08 contacts (polarized Highspeed card edge connector for PCB's with 40 contacts (polarized Highspeed card edge connector for 2.4mm PCB's with 05 contacts (not polarized Highspeed card edge connector for 1.6mm PCB's with 05.

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