Labels Milestones
Back1.2x1.8x1.55 mm Body (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Shrink Small Outline (SO), see https://docs.broadcom.com/docs/AV02-0173EN 4-Lead Plastic Small Outline (SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true SSO Stretched SO SOIC 1.27 SSO, 7 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils), LongPads 10-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), SMDSocket, LongPads 8-lead though-hole mounted DIP package, row.
- Vertex 2.684762e+000 -5.028090e+000 9.983999e+000 vertex 5.222623e+000.
- Horizontal RM 2.54mm staggered type-1 TO-220-4, Horizontal, RM.