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TSSOP HTSSOP 0.65 thermal pad with vias; (http://www.ti.com/lit/ds/symlink/drv8800.pdf HTSSOP, 16 Pin (https://www.haloelectronics.com/pdf/discrete-ultra-100baset.pdf), generated with kicad-footprint-generator Soldered wire connection, for 6 times 0.127 mm² wires, basic insulation, conductor diameter 1.7mm, outer diameter 3.6mm, size source Multi-Contact.

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