3
1
Back

High-volatge DIP package (based on standard DIP-4), row spacing 7.62 mm (300 mils 32-lead surface-mounted (SMD) DIP package, row spacing 6.15 mm (242 mils), body size 6.7x6.64mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 2x-dip-switch SPST , Piano, row spacing 7.62 mm (300 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil SMDSocket SmallPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 16-lead surface-mounted (SMD) DIP package, row.

New Pull Request