3
1
Back

Pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=262, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double cols (from Kicad 4.0.7), script generated Through hole angled pin header THT 1x23 2.54mm single row (from Kicad 4.0.7), script generated Through hole angled socket strip, 1x35, 2.00mm pitch, 6.35mm socket length, double rows Through hole pin header SMD 2x20 2.54mm double row Through.

New Pull Request