3
1
Back

FBGA-78, 10.6x7.5mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=25 FBGA-78, 10.5x9.0mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=25 FBGA-78, 10.5x9.0mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, https://www.ti.com/lit/ml/mpbg777/mpbg777.pdf BGA 289 0.8 ZAV S-PBGA-N289 Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 (perimeter) array, NSMD pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 14x14 grid, 8x8mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row (from Kicad 4.0.7), script generated Surface mounted pin header THT 2x35 2.00mm double row Through hole straight socket strip, 2x40, 1.27mm pitch, single row (from Kicad 4.0.7!), script generated Through hole straight pin header, 2x27, 1.00mm pitch, double rows Through hole angled pin header THT 1x10 1.27mm single row Through hole socket strip THT 1x16 2.54mm single row Surface mounted socket strip SMD 1x31 1.27mm single row (from Kicad 4.0.7), script generated Through hole angled pin header, 1x03, 1.27mm pitch, 4.4mm socket length, double rows Through hole straight pin header, 2x13, 2.54mm pitch, single row Through hole angled pin header.

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