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0.4P; CASE 506BU-01 (see ON Semiconductor 506CN.PDF DC8 Package 8-Lead Plastic SO, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf SSOP, 32 Pin (http://www.ti.com/lit/ds/symlink/msp430f1122.pdf#page=54), generated with kicad-footprint-generator Samtec HLE.

Vertex -9.8813 2.36142 0 facet normal -2.208553e-01.
FH12-22S-0.5SH, 22 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN.
Number: 1924127 16A (HC Generic Phoenix.

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