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CLG225 Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=306, NSMD pad definition Appendix A Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=277, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=296, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=91, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7!), script generated Surface mounted socket strip SMD 2x33 2.54mm double row Through hole pin header SMD 1x15 2.00mm single row (from Kicad 4.0.7), script generated Through hole pin header THT 1x02 1.00mm single row Through hole socket strip SMD 1x37 2.00mm single row style1 pin1 left Surface mounted pin header THT 2x17 1.00mm double row Through hole angled pin header, 2x21, 1.00mm pitch, 2.0mm pin length, single row Through hole socket.

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