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Diameter 7.2mm MuRATA 1700 Inductor, Radial series, Radial, pin pitch=5.00mm, , diameter=10mm, Electrolytic Capacitor CP, Radial series, Radial, pin pitch=10.00mm, , length*width=13*4mm^2, Capacitor, http://www.wima.com/EN/WIMA_FKS_3.pdf, http://www.wima.com/EN/WIMA_MKS_4.pdf C Rect series Radial pin pitch 5.08mm size 55.9x10.6mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00017, 7 pins, pitch 7.5mm, size 44x15mm^2, drill diamater 1.3mm, pad diameter 2.6mm, see http://www.mouser.com/ds/2/324/ItemDetail_1935161-922578.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix THT Terminal Block 4Ucon ItemNo. 10703 vertical pitch 3.5mm size 25.5x8.3mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00046 pitch 5mm size 55x8.1mm^2 drill 1.1mm pad 2.1mm Terminal Block 4Ucon ItemNo. 10689 pitch 3.5mm size 42x7.6mm^2 drill 1.2mm pad 3mm Terminal Block Phoenix PTSM-0,5-5-2.5-H-THR, 5 pins, pitch 5mm, size 10x8.3mm^2, drill diamater 1.2mm, pad diameter 2.1mm, size source Multi-Contact FLEXI-E 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 2 times 1 mm² wires, reinforced insulation, conductor diameter 1.7mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py WSON, 8 Pin (https://www.ti.com/lit/ds/symlink/ina333.pdf#page=30), generated with kicad-footprint-generator ipc_gullwing_generator.py 44-Lead Plastic Thin Shrink Small Outline No-Lead http://www.ti.com/lit/ml/mpds176e/mpds176e.pdf Plastic Small Outline No-Lead http://www.ti.com/lit/ml/mpds176e/mpds176e.pdf Plastic Small Outline (ST)-4.4 mm Body [WSON], http://www.ti.com/lit/ml/mpds421/mpds421.pdf WSON-16 3.3 x 1.35mm Pitch 0.4mm 8-Lead Plastic Dual Flat, No Lead Package (8MA2) - 2x3x0.6 mm Body [SOIC] (https://docs.broadcom.com/docs/AV02-0169EN SOIC 1.27 16 12 Wide 16-Lead Plastic Small Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 12x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), LongPads 22-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 6.7x21.88mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 7x-dip-switch SPST , Slide, row spacing 22.86 mm (900 mils THT DIP DIL PDIP 2.54mm 7.62mm 300mil LongPads 4-lead though-hole mounted DIP package, row spacing.

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