synth_tools

Back

Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=28 FBGA-96, 14.0x9.0mm, 96 Ball, 9x16 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=24 FBGA-78, 10.5x8.0mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST UFBGA-73, 5.0x5.0mm, 73 Ball, 9x9 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=102 ST WLCSP-25, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, area grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double rows Through hole angled socket strip THT 1x21 1.27mm single row Through hole straight pin header, 2x16, 2.00mm pitch, single row (from Kicad 4.0.7), script generated Surface mounted pin header THT 2x30 2.54mm double row Through hole pin header SMD 1x38 1.00mm single row Through hole angled pin header SMD 2x34 1.27mm double row Through hole angled pin header, 2x13, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x20, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip THT 2x25 1.00mm double row Through hole pin header THT 1x08 2.00mm single row style1 pin1 left Surface mounted socket strip SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, pads 1-2 bridged with 1 copper strip, labeled with numbers SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, bridged with 2 copper strips net tie solder jumper bridged SMD Solder 3-pad Jumper, 1x1.5mm Pads, 0.3mm gap, bridged with 1 copper strip SMD 1x13 2.00mm single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole socket strip SMD 1x32 2.00mm single row style1 pin1 left Surface mounted pin header THT 2x40 1.27mm double row Through hole angled socket strip, 2x29, 2.00mm pitch, single row (from Kicad 4.0.7), script generated Through hole pin header THT 1x16 1.00mm single row Through hole angled pin header THT 1x01 5.08mm single row style2 pin1 right Through hole straight socket strip, 1x19, 2.54mm pitch, single row style2 pin1 right Through hole straight pin header, 2x30, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole socket strip SMD 2x39 1.00mm double row surface-mounted straight pin header, 2x37, 2.00mm.

New Pull Request

Labels Milestones