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Mils 48-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 42-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), missing pin 7 removed (Microchip Packaging Specification 00000049BS.pdf MSOP, 12 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_12_%2005-08-1855.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py VQFN, 48 Pin (http://www.ti.com/lit/ds/symlink/cc1312r.pdf#page=48), generated with kicad-footprint-generator ipc_noLead_generator.py 44-Lead Plastic Thin Quad Flatpack (PT) - 7x7x1.0 mm Body [SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 8x-dip-switch.

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