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BOM files *.xml *.csv # KiCad backups folders temp_* # Compressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) T5 15.200mm 0.5984" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) T5 15.200mm 0.5984" (1 hole Total plated holes count 16 ============================================================= Total unplated holes count 0 Minor layout tweaks Finish schematic, add PDF Finish schematic, add PDF | J6 | 1 | ICM7555xP | CMOS General Purpose Timer, 555 compatible, PDIP-8 Quad operational amplifier, DIP-14 Width 3.3mm, pitch 5mm Varistor.

  • PC-16 Dual, http://www.piher-nacesa.com/pdf/20-PC16v03.pdf Potentiometer horizontal Bourns 3214G Potentiometer.
  • TSSOP, 36 Pin (http://www.issi.com/WW/pdf/61-64C5128AL.pdf), generated.
  • U3-8? No, transistors maybe.
  • New Pull Request