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BackOf http://www.st.com/resource/en/datasheet/stm32l011k3.pdf WLCSP-36, 6x6 raster, 2.61x2.88mm package, pitch 0.8mm TFBGA-121, 11x11 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=266, NSMD pad definition Appendix A BGA 484 1 FB484 FBG484 FBV484 Artix-7, Kintex-7 and Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=305, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Surface mounted pin header 3-pin CPU fan 4-pin CPU fan Through hole pin header THT 1x10 2.54mm single row Through hole pin header THT 1x07 1.00mm single row style1 pin1 left Surface mounted pin header SMD 1x26 2.54mm single row style2 pin1 right Through hole straight socket strip, 2x13, 1.27mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole IDC box header, 2x17, 2.54mm pitch, 6mm pin length, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x14, 2.00mm pitch, 4.2mm.