3
1
Back

Mm Body [DFN-S] (see Microchip Packaging Specification 00000049BS.pdf SSOP, 32 Pin (JEDEC MO-153 Var JD https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Soldered wire.

New Pull Request