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Oscillator TXCO Fordahl DFA S2-KS/LS/US, http://www.iqdfrequencyproducts.com/products/details/iqxo-70-11-30.pdf, hand-soldering, 7.0x5.0mm^2 package SMD Crystal Oscillator Seiko Epson SG-8002CE https://support.epson.biz/td/api/doc_check.php?mode=dl⟨=en&Parts=SG-8002DC, 3.2x2.5mm^2 package SMD Crystal MicroCrystal CC8V-T1A/CM8V-T1A series http://www.microcrystal.com/images/_Product-Documentation/01_TF_ceramic_Packages/01_Datasheet/CC8V-T1A.pdf, hand-soldering, 2.0x1.2mm^2 package SMD Crystal Seiko Epson MC-505 http://media.digikey.com/pdf/Data%20Sheets/Epson%20PDFs/MA-505,506.pdf, hand-soldering, 12.7x5.1mm^2 package SMD Crystal SERIES SMD2520/2 http://www.icbase.com/File/PDF/HKC/HKC00061008.pdf, 5.0x3.2mm^2 package Abracon Miniature Ceramic Smd Crystal ABM3B http://www.abracon.com/Resonators/abm3b.pdf, 5.0x3.2mm^2 package 3.2x2.5mm, 1-220MHz High Performance Differential Oscillator SiTime SiT9121 https://www.sitime.com/datasheet/SiT9121 Silicon_Labs LGA, 6 Pin (http://www.nve.com/Downloads/ab3.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 16-Lead Plastic DFN (5mm x 3mm) (see Linear Technology DFN_16_05-08-1732.pdf DHC Package; 18-Lead Plastic DFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (2mm x 2mm) (see Linear Technology DFN_16_05-08-1706.pdf DHD Package; 18-Lead Plastic DFN (5mm x 5mm); (see http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-32/CP_32_27.pdf LFCSP, 48 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ltc2358-16.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 20 Pin (http://www.ti.com/lit/ds/symlink/opa569.pdf, http://www.ti.com/lit/an/slma004b/slma004b.pdf), generated with kicad-footprint-generator JST PHD series connector, B08B-PUDSS (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for a single 0.5 mm² wires, reinforced insulation, conductor diameter 1.4mm, length 8.5mm, width 2.8mm, e.g. Ettinger 13.13.890, https://katalog.ettinger.de/#p=434 Through hole angled socket strip, 2x04, 1.27mm pitch, single row (from Kicad 4.0.7), script generated Through hole straight Samtec HPM power header series 3.81mm post length THT 1x10 2.54mm single row style1 pin1 left Surface mounted socket strip SMD 1x23 1.27mm single row Through hole pin header SMD 1x03 2.54mm single row Surface mounted socket strip SMD.

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