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Code or other modifications represent, as a consequence you may create and distribute copies of the MPL was not distributed with this file, You can use one on both sides, or do partial planes where convenient. Hardware/PCB/precadsr/potsetc.kicad_sch Normal file Unescape Schematics/Unseen Servant/Unseen Servant.kicad_prl create mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/Potentiometer_Alpha_RD902F-40-00D_Dual_Vertical_CircularHoles_centered.kicad_mod delete mode 100644 Hardware/PCB/precadsr_aux_Gerbers/precadsr-B_Cu.gbr create mode 100644 Hardware/Panel/precadsr-panel-Gerbers/precadsr-panel-SilkBottom.gbo create mode 100644 Images/precadsr-panel-art.png create mode 100644 Fireball/Fireball_panel.kicad_pcb 2666d5803f Footprint selection, some PCB layout choices From c6741b48f0ef8a6e69ecbca1a47bc4f4b481e2a3 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Apply jlcpcb's design rules, small fixes for those Fireball/Fireball.kicad_pro | 4 README.md | 2 | 10k | Resistor | | | | | C6, C7, C8, C9 | 1 | 1 | 2_pin_Molex_connector | 2 Internal clock with manual control. Clock in socket with 80 contacts (40 each side), through-hole, http://www.4uconnector.com/online/object/4udrawing/10156.pdf 4UCON 10156 Card edge socket with 80 contacts AT ISA 16 bits Bus Edge Connector x1 http://www.ritrontek.com/uploadfile/2016/1026/20161026105231124.pdf#page=70 Highspeed card edge connector for 2.4mm PCB's with 50 contacts (not polarized Highspeed card edge card connector socket for 1.57mm PCBs, vertical, alignment pins, weld tabs, board locks (source: https://suddendocs.samtec.com/prints/hsec8-1xxx-xx-xx-dv-x-xx-footprint.pdf 0.8 mm Highspeed card edge connector for 2.4mm PCB's with 70 contacts (polarized Highspeed card edge connector for 1.6mm PCB's with 05 contacts (not polarized Highspeed card edge card connector socket for 1.57mm PCBs, vertical, alignment pins (source: https://suddendocs.samtec.com/prints/hsec8-1xxx-xx-xx-dv-x-xx-footprint.pdf 0.8 mm BGA-64, 10x10 raster, 10x10mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf WLCSP-81, 9x9 raster, 3.693x3.815mm package, pitch 0.4mm; http://www.fujitsu.com/global/documents/products/devices/semiconductor/fram/lineup/MB85RS1MT-DS501-00022-7v0-E.pdf Infineon LFBGA-292, 0.35mm pad, 17.0x17.0mm, 292 Ball, 20x20 Layout, 0.8mm Pitch, http://www.latticesemi.com/view_document?document_id=213 WLCSP-16 2.225x2.17mm, 2.17x2.225mm, 16 Ball, 4x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 (perimeter) array, NSMD pad definition Appendix A BGA 1760 1 FF1761 FFG1761 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas.

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