3
1
Back

Ipc_gullwing_generator.py TSSOP28: plastic thin shrink small outline package; 16 leads; body width 4.4 mm; thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 506AF.PDF DKD Package; 24-Lead Plastic Shrink Small Outline (SN) - Narrow, 3.90 mm Body [VSON] http://www.ti.com/lit/ds/symlink/csd87334q3d.pdf VSON, 10 Pin (https://fscdn.rohm.com/en/techdata_basic/ic/package/Jisso_MLGA010V020A-1-2_Rev005s_E2(MSL3).pdf ST HLGA, 10 Pin (http://www.ti.com/lit/ds/symlink/tps7a91.pdf#page=30), generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP, 32 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation BA.

New Pull Request