synth_tools

Back

Relay 1-Form-C Schrack-RYII RM3.2mm SPDT Panasonic Relay DPDT, http://www3.panasonic.biz/ac/e_download/control/relay/power/catalog/mech_eng_jw.pdf?via=ok Relay SPST Schrack-RP-II/1 RM5mm 16A 250V AC Form C http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=RT2_reflow&DocType=DS&DocLang=EN relay dpst fujitsu tht Kemet signal relay, DPDT, non-latching, single coil latching, https://content.kemet.com/datasheets/KEM_R7002_EC2_EE2.pdf Kemet EC2 signal relay DPDT double dual coil latching through hole M2, height 2.5, Wuerth electronics 9774050960 (https://katalog.we-online.de/em/datasheet/9774050960.pdf,), generated with kicad-footprint-generator Connector Phoenix Contact, SPT 5/4-H-7.5-ZB Terminal Block, 1732438 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1732438), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: 5273-03A example for new part number: AE-6410-15A example for new mpn: 39-29-4149, 7 Pins per row (https://www.molex.com/pdm_docs/sd/430450201_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-123-02-xxx-DV-BE-LC, 23 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.25mm, height 5, Wuerth electronics 9774080982 (https://katalog.we-online.de/em/datasheet/9774080982.pdf), generated with kicad-footprint-generator TE, 826576-2, 2 Pins per row (http://www.molex.com/pdm_docs/sd/431600105_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOJ, 36 Pin (http://www.issi.com/WW/pdf/61-64C5128AL.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP, 16 Pin (https://www.st.com/resource/en/datasheet/stspin220.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 5 times 1 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST SH series connector, 502585-0270 (http://www.molex.com/pdm_docs/sd/5025850270_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 8 Pin (http://www.ti.com/lit/ds/symlink/lp2951.pdf#page=27), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-130-02-xx-DV-TE, 30 Pins (http://www.molex.com/pdm_docs/sd/547220804_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 2x4 (perimeter) array, NSMD pad definition Appendix A BGA 1760 1 FF1761 FFG1761 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=302, NSMD pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition Appendix A BGA 1156 1 FF1156 FFG1156 FFV1156 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=264, NSMD pad definition Appendix A BGA 900 1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=275, NSMD pad definition Appendix A Artix-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=306, NSMD pad definition Appendix A BGA 1156 1 FF1156 FFG1156 FFV1156 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=275, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=306, NSMD pad definition Appendix A BGA 484 0.8 RS484 Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments.

New Pull Request

Labels Milestones