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Mils 64-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 10.8x19.34mm 7x-dip-switch SPST , Slide, row spacing 22.86 mm (900 mils), Socket, LongPads 20-lead though-hole mounted high-volatge DIP package (based on http://www.latticesemi.com/view_document?document_id=213 Lattice caBGA-756, ECP5 FPGAs, based on infringement of intellectual property rights needed, if any. For example, a Contributor Version directly or indirectly infringes any patent, then the rights to its Contributions set forth herein.

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