Labels Milestones
Back1.4715x1.4715mm, 9 bump 3x3 (perimeter) array, NSMD pad definition Appendix A BGA 900 1 FF900 FFG900 FFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=262, NSMD pad definition (http://www.ti.com/lit/ml/mpbg674/mpbg674.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf UCBGA-36, 6x6 raster, 2.61x2.88mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152zd.pdf WLCSP-64, 8x8 raster, 3.141x3.127mm package, pitch 0.65mm VFBGA-86, 6.0x6.0mm, 86 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l562ce.pdf ST WLCSP-90, ST.
- Pin (https://www.jedec.org/system/files/docs/MO-220K01.pdf (variation VJJD-5)), generated.
- Vertex -1.043145e+02 9.725134e+01 1.020733e+01 vertex -1.043020e+02 9.695134e+01.
- [ 0,0,h2], [ ord*cos(lf0), ord*sin(lf0), h2], [ ird*cos(lf1.
- -1.037469e+02 9.554692e+01 2.550000e+00 facet.
- 9.204234e+01 4.255000e+01 facet normal -0.0814915 -0.0817041 0.993319.