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ST WLCSP-115, ST die ID 483, 3.73x4.15mm, 115 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121, 11x11 raster, 10x10mm package, pitch 0.4mm; see section 6.6 of http://www.st.com/resource/en/datasheet/DM00273119.pdf X1-WLB0909, 0.89x0.89mm, 4 Ball, 2x2 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, area grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row style1 pin1 left Surface mounted pin header THT 2x31 2.54mm double row surface-mounted straight socket strip, 2x07, 2.54mm pitch, double rows Through hole pin header THT 1x17 1.00mm single row Through hole angled socket strip, 2x29, 1.27mm pitch, single row style1 pin1 left Surface mounted socket strip SMD 1x38 2.54mm single row style2 pin1 right Through hole pin header SMD 1x21 2.54mm single row Through hole horizontal IDC header triangle being so far out ...Header_2x05_P2.54mm_Vertical_Fixed_Ground_Fill.kicad_mod | 6 Kosmo_panel | 1 | 3_pin_Molex_connector | 3 | 4.7k | Resistor | | C7, C11 | 2 | 1N5817 | Schottky Barrier Rectifier Diode, DO-41 | | R1, R2 | 2 | 4.7k | Resistor | | | | S3 | 1 nF | Unpolarized capacitor | | Tayda | A-1157 or A-2425 | | | | | J1 | 1 | | .

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