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R-XBGA-N8 Texas Instruments, BGA Microstar Junior, 7x7mm, 113 ball 12x12 grid, NSMD pad definition Appendix A BGA 900 1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 30x30 grid, 31x31mm package.

• "B.Adhes" user "B.Adhesive" (33 "F.Adhes" user "F.Adhesive.
• 0.990435 0.0975568 vertex 1.75581.
• Type094_RT03503HBLU pitch 5mm size 11.5x15mm^2 drill 1.2mm pad.

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