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Pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double cols (from Kicad 4.0.7), script generated Through hole pin header SMD 2x37 1.00mm double row Through hole angled pin header, 1x16, 1.00mm pitch, single row style1 pin1 left Surface mounted pin header THT 2x37 2.00mm double row Through hole pin header THT.

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