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Technology DFN_16_05-08-1706.pdf DHD Package; 18-Lead Plastic DFN (7mm x 4mm) (see Linear Technology DFN_6_05-08-1703.pdf 6-Lead Plastic DFN (3mm x 2mm) (see Linear Technology DFN_8_05-08-1702.pdf 8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with missing pin 5, row spacing 5.9 mm (232 mils), body size 9.78x32.66mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 10x-dip-switch SPST Copal_CHS-10B, Slide, row spacing 25.4 mm (1000 mils), Socket 64-lead though-hole mounted DIP package, row spacing 16.51 mm.

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