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Spacing 15.24 mm (600 mils), Socket, LongPads 20-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil reed relay Standex-Meder SIL-relais, Form 1B, see https://standexelectronics.com/wp-content/uploads/datasheet_reed_relay_SIL.pdf Standex-Meder SIL-relais, UMS, see http://cdn-reichelt.de/documents/datenblatt/C300/UMS05_1A80_75L_DB.pdf.

106584 bytes 3D Printing/Rails/36hp_outie.stl.
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HTSSOP28: plastic thin shrink small outline.
Normal 0.946485 -0.307054 0.0994239.

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