Labels Milestones
BackPlastic thin shrink small outline package; 44 leads; body width 6.1 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf HTSSOP, 38 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_38_05-08-1701.pdf), generated with kicad-footprint-generator Molex SPOX horizontal Molex KK 396 Interconnect System, old/engineering part number: A-41792-0017 example for new part number: 22-27-2091.
- -5.925223e+000 9.983999e+000 vertex 5.576935e+000.
- -0.290276 -0.956943 -0 facet normal 4.391191e-002 -7.528147e-002 9.961950e-001.