Labels Milestones
Back9.8mm, pin pitch 2.50mm diameter 5mm Fastron MISC Inductor, Axial series, Axial, Horizontal, pin pitch=18mm, , length*diameter=11*5mm^2, Electrolytic Capacitor CP, Radial_Tantal series, Radial, pin pitch=31.00mm, , diameter=35.1mm, Vishay, TJ6, http://www.vishay.com/docs/34079/tj.pdf L_Toroid Horizontal series Radial pin pitch 17.5mm, see http://yourduino.com/docs/Photoresistor-5516-datasheet.pdf Resistor, LDR 5x4.1mm, see http://cdn-reichelt.de/documents/datenblatt/A500/A90xxxx%23PE.pdf Resistor, LDR 5x4.1mm, see http://cdn-reichelt.de/documents/datenblatt/A500/A90xxxx%23PE.pdf Resistor, LDR 5.2x5.2, upright, see http://cdn-reichelt.de/documents/datenblatt/A500/M996011A.pdf Resistor, LDR D=6.4mm, see http://yourduino.com/docs/Photoresistor-5516-datasheet.pdf Sharp OPIC IS471F, see http://pdf.datasheetcatalog.com/datasheet/Sharp/mXvrzty.pdf Sharp OPIC, IS485, IS486, see http://microrato.ua.pt/main/Actividades/Estagios/Docs/IS485_6.pdf Sharp OPIC IS471F, see http://pdf.datasheetcatalog.com/datasheet/Sharp/mXvrzty.pdf Sharp OPIC, IS485, IS486, see http://microrato.ua.pt/main/Actividades/Estagios/Docs/IS485_6.pdf Sharp OPIC IS471F, see http://pdf.datasheetcatalog.com/datasheet/Sharp/mXvrzty.pdf Sharp OPIC, IS485, IS486, see http://microrato.ua.pt/main/Actividades/Estagios/Docs/IS485_6.pdf Sharp OPIC IS471F, see http://pdf.datasheetcatalog.com/datasheet/Sharp/mXvrzty.pdf Sharp OPIC, IS485, IS486, see http://microrato.ua.pt/main/Actividades/Estagios/Docs/IS485_6.pdf Sharp OPIC IS485 IS486 package for diode bridges, row spacing 7.62 mm (300 mils), Socket 18-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 22-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 10-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 4x-dip-switch SPST , Slide, row spacing 9.53 mm (375 mils), Clearance8mm 12-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket 24-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 3x-dip-switch SPST , Slide, row spacing 8.61 mm (338 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 5x-dip-switch SPST CTS_Series194-5MSTN, Piano, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 22-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 8x-dip-switch SPST Copal_CVS-08xB, Slide, row spacing.
- Size source: https://www.nikhef.nl/pub/departments/mt/projects/detectorR_D/dtddice/ERJ2G.pdf), generated with kicad-footprint-generator Soldered.
- (end 155.96 122.79 (end 155.96 120 (end 154.25.
- 10.2x11mm^2 drill 1.4mm pad 2.6mm Terminal.